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DATE
28-Jan-99
I. These Techincal literature include materials protected under &hecopyright of Sharp Corporation ("S'ha@). PIease not reproduce cause do or anyoneto reproduce themwithout Sharp's consent. 2. Whenusingthis product,please observe the absolut: maximum ratings andthe instructions useoutlined for in these specificationsheets, as well as the precautions mentioned below. Sharpassumes responsibility no for anydamage resulting ficm useof the productwhich dcesnot comply with the absolute maxirn~m ratings md the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This productsis designed usein the foUowing for application areas; 7 l 0.4 equipment * Audio visual equipment * Homeappliance + Telecommunication equipment (Terminal) l Measuringequipment * Tooling machines * Compulers I I If the useof the productin the aboveapplication areas for equipment is listedin paragraphs (2) or (Z), please sue to observe precautions be the given in those respective paragraphs. (2) Appropriatemeasures, asfail-safe such designandredundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
andsafety when&is productis usedfor equipment whichdemands reliability and high safetyin function andprecision,such ; as r l Transportation control and safety equipment (aircraf?, aain, automobile etc.) 1 * Traffic sign& * Gasleakage sensor breakers l Rescue securityequipment and L l Other safety equipment _I (3) Please not usethisproductfor equipment do whichrequireexnemeiyhigh rehability
r
L
and safety in function and precision, such 5s ; l Space equipment * Telecommunication equipment (for trunk lines) ' Nuclear power control equipment * hfedical equipment
1
(4) Please contact and consult with a Sharp sales representative if there are any questions regardinginterpretationof the above three paragraphs.
3. Please contact andconsultwith a Sharpsales representative any questions for aboutthis product.
** The technical literature is subject to be changed without notice **
Opto-Electronic Devices Division
Electronic Components Group
SH.AFW CORF'ORATION
DG-991015 MOD& NJ. G?viSWT95200A
1 Jan/T8/99 PAGE 17 l/13
GMSIn95200A
technical Wrature
1. AppliCXian Thi.~ technicat Litemure appk to the light en&kg diode device MO&I NO. GM5WT952oOA 1 Chip type white LED (GaN chip LED device)
..,.................~.RefertotheanachedsheetPage2. 2. Outline dimensions terminal and CO~UXC~~OCS . . . . . . . . . . . . . . . . . . . . .. . . . ..`.......... Refer to the attachedsheetPage3-5 3. Ratingsandcharacteristics 3-1. Absolutemaximumratings Electra characteristics Optical characteristics Ltious intensity rank Color coordinates ranks Deratingcurve Characteristics chart 4. Reliability ..,,...............I.........
3-2. 3-3. 3-1. 3-J. 3-6. 3-7. 4- 1. Test itemsandtest conditions 4-2. Failurejudgementcriteria
--.--..-.-.-...-.-......RefertotheattachedsheetPage6.
Page 7. 5. Incomin_e inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to theattachedsheet 5-1. Inspectionmethod 5-2. Descriptionof inspection criteria and Referto the attached sheetPage8-I 1. 6. Taping specification..,........*,.................,...........*. 6-I. Taping 6-2. Label 6-3. Dampproofpackage 7. Soldc.+g . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage 12. 7-1. Reflow solderins
7-2.Mylual soldering
7-3. Dip solderingmethod 8. Precsutions for use . . . . . . . . . a. . . . . . . . . . -.......-.g...o.....,-..IRefer 8-l. Precautions maners designing for circuit 8-2. Cleaning method 9. Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~.................... 9-I. Ozonosphere destructivechemicals. 9-2. Brornic non-burningmaterials to &e attachedbeet Page13.
Refer to theattachedshett Page13.
DG-991015
iMODEL X-a.
1 Jan/21iii%) PAGE -
GM5WT352OOX
I
2J13 -
2. Outline dimensions terminalconnections and
f-
.
~thade
mark
aa . P
-p+- \ ' II 6 .,-.i__-- L,-J _-_-IkL -------- --------Ql 3-L
1 /I-' I.2 !.I
!
I I
0
N`OIC. 1. It is
not
Anode /
@ Cathode /
@ Cathode
Lo Td
includethe flash in this dimension. 0 Anode
2. Pin Connection
3. Unspecified toleranceto be k0.2
unit BIB
Scale Free
ApplicableModel
Gbt5w-r95?00A
rhwhg No. 51101014
c
.-
..-..-.."-...'. .`
.-
3. Raiogs andcharac:erktics 3- 1.Ahsolutemaximumratings P3rameter Powerdissipation Continuous fonvard current Peakforward current @ore 1) Dcrating factor
I
_ e-1--- _, -' .y- ' : ;. .`; _, `L . . -; . . .. ,-
(Syabolt 1PI
IF
--~ 30 IlLA
hl
DC PulseI
Reverse voltage Operatingtempenture Storagetemperature Solderingtemperature@ate 2) (Hotel) Duty ratio=1/10,Pulse width+.lms (Note') Manual solderingMax3second 3-2. Elec&ocharacteristics ,Parameter /Symbol1 Forwardvoltage VF Reverse current 1s
va 1 Topr 1 1 Tstg 1 1 Tsol 1
50 0.10
0.67
llL4 t&4x
IDA/t
5 40 to +100 40 to Cl00 295
1v ( "C 1 oc 1 "C
conditions I&omt\ VR=4V
1 MIN. 1w
lYP. 1hf.4x. 1 3.8 1 4.5 1 1 100 I
(Ta=tS"C) Lhit V PA 1
I-
3-3. Optid characteristics Condition Luminous intensity `3
Iv(mcd)TYP.
Ta=T5'C) luminous intensityra&
7
Model No. -GMSWT%?OOA
color coordinates ranks
oiPlQ
G(H'(I(J IF=20mX 200 (NoteS)Ueasured by SHARP EGBG MODELS50 (RadiometerflhotonetersWem) , 1 Unit
3d.Luminous intensityrank Rank : Luminous intensity /Rank : Luminous intensity b : 4.8 9.2 j E : 43 84 a : 6.9 13.2 / F : 62 121 A : 10 19 ; i 1;; - 174 8 : 14 28 i - 250 c : 21 40 I I : 185 - 360 D : 30 ;a 1 J : 266 - 518
mcd
olerance: 215%
DG-991015 .UODEL No. GiLf5W95200A ,_coordilares ranks -. . .. .- c-.-1. :.= ., i' `\ : .:
Jaw28199 j P.G' .;4/13 "- 3 . .- -
3-S.Color
Rank
:
Color coordinstes I 0.32 0.36 0.40 1 i ' 0.2 0.22 0.26 Y 0. 38 0. 40 0.44
Rank 0 P 0 S-6. Derating curve 0.26 0.3 0.34 -
X
Peak Forward Currenr Daating Cum
Fotward Current Dcrafing Curve
60
-40
-20
0 20 40 60 80 Ambittnr Tcmpraturc T$C) Pelk Forward Current vs. Dub Ratiofla=2%)
100 120
-40
-20
0 20 40 60 80 Ambitcnt Tanpraturo Tat%)
100 120
- l/lW
l/10 Duty Ratio DR
l/1
(Note Above charxteristic
data are t)-pical km and not . gurvlted -
data
-
DG-991015
MCDEI. Ya
I
Sad2889 _
PACZ
GMSWT952OOA
3-7. Characmisticschart
5113 -
RelativeLuminous Intesity vs. Fommd Cm
t.TaPt5Q
Fonvard Cumt vs. Forward Vduge (~~25'~ :
loooK
1% 0. I
0. 1 10 Forward Current I&4) too
1
4 2 3 Forward Voltage V,zo
5
. .. .`i ..`,I, . ; i'; .. `. I. (`. .c . G i -I_...- - .' * -;*-._ w. -
..
n [Aote)Above charxteristic data aretypical dataandnot gumted dam.
w-r95 _
DG-99lOU hfODES No.
GSi5i-GT95200.A
JaGG PAGE
6113
4. Rcliabiliry The rcliabtity ofptoducrs shallbesatisfied with items listedbelow.
r
4-1. Test itemsand:es concliricns Test items Testconditions
Confidence level: 90%
S~plCS
10
10
temperature cycling Hieh temp'and`@ humidicystorage High temperature storage Low temper3rure storage
-tO~C(jOmin)~+1OOt(3Omin),lCOCy
n=22, c4
n=22,c=4
TazT6$C, NKRK, pI00Oh Ta=(Tng-maximumratings),r-1030h Ta=(Tstg-minimunratings),r IOCOh ITa=25'C,Ie(IF-maximumratings),~lOOOh
15 000m/s',0.5ms,3timesJ~X,iY~Zdirection ZOOmis', 100-2 OOO-100Wsweepfor ZOmin.,4times/yY,Z direction
n=22, c-0 n=22,C=tl
~n=22,c=q n=ll,C=o
10 IO
10 20
IOpcratig test
kfechtical shock Vtiabte frequency vibration Soldering heat
n=I 1,C-0 n=ll,C=o
z" 20
Refer to the attachedsheetgage 12'13 1 time
5-2. Failure judgemeatcriteria (Sotel) Parameter r Forwardvoltage Reverse cuneat Luminous intensity Symbol VF
IR
IV
Fail
judgementcriteria (Noted)
v,> I,> U.S.L. x I.2 U.S.L. ' 2.0
Iv > The first stagevalueX 1.5 or The Jirststage valueX 0.5 > Iv
fiote I)Mcasuringconditioais in accordance specification. with (Note2)U.S.L.is shown UpperSpecificationLimit. by
DG-991015
MODEL So.
I JaanS
1PAGE
5. hcoming insptc5on 5-I. lrq-mion method A single sampling pla normal inspection level II based on IS0 2859-I shail be adopted
-. "M.*y.wU "I yuYb"LA"Y YUY .aI..`a"
NO. 1 2 3 4 5
6 7 8
inspection items Openhon Radiation color Taping Label Electro-opcical characteristics Outlinedimensions Dust andflaw
-..-. Resin f f ash
Criteria No light emission Not cmreicl Product inserted in reverse direction Model number is not printed,or misprinted Not conforming to the specification Not conforming the specifhion to Effect to the specification
0.3mm or greater&om theproduct
Defect
AQL
gg
0.1%
DG-991015 MODEL No. GMSWI95200X
Janf2??i99 P?rGE a13
6. Taping 61 Taping 6-I-LShape and dimension of tapc(TYP.)
Parameter
1 Symbol lDimension
Remarks
1 Thickness 1 t , 0.3 2.3 Thickness of the entire tit 1 tt 1 % Mated : Carrier titpe...PS,Cover tape...Polyestcr
I (With cover tape andcarrier tape combined
DG-991015
MODEL No.
I
6-I-t.Shape and dimension of reel(lYP
GMSW95200X
1 9113
Parameter
1Symbol] Dimension 1
Remarks
I
Diameter Frange Thickness Inner mace direction
EXtf Emal diameter
rmm--.)
A t
I
d I78 1.5
IO Dimensinn
--_------
w
of shaft core
--
Hub
Soindle hole diameter
Key slit f Width
1s IC
1 E
t
Jotation % Material : Reel...Polystyrene
I I Depth ) u t for part name etc.
t
q&o d13 r-2.0 4.5
(Labeling on one side of flange.@art name,quantity,Iot No.)
1 t I I
I
I I
DG-991015 MODEL No. GM5WT95200A
sanRa/99 PAGE 10113
6-I-3.Taping specification (1) Lead tape:
End
~~11 I-> out
Bigining
Stuffed 10 plch or mare 10
Empty pfi;h or nore
Leading
' 40-50 pith
(2) Cover tape stxngth against peeJing:F=O.148N( Cover taue
6 =lO"or less)
uuuuuuuduuuu
w Forward Carrier tape
Tape speed : 5mm/s
(3) Tape strength against bending: The rndius ofbendiug circle should be 30mm or more. Lfit is less than 3Omm the cover may peel. (4) Jointing of tape: There should not be joint of cover tapeor carrier tape. (5) Quantity per reel: Average2,OOOpcs. reel per (6) Product wcighr Approx. 0.03 g (7) others: 0 Apparent defect of productahorrId bepackedandproductshouldnot upset. not 0 There shouldnot be missing abovecontinuous three products. @ Productsshouldbe easilytakenout. @ Productsshouldnot be aaached the cover tapeat peeling. to 6-2. Labelfor reel
C~lJwr9s20M
QUA.TY 2000
- Model number
Lot number *--r
LOT No. KWBHOI
-=EIAJ C-3> WE
M JAPAN
- Luminous rank anddominantwaveIength rank + Productioncountry
* :Lot numberindication
0 Productionplant code(tobe indicatedalphabetically) @ ProductionIot(singleor doublefigures) 0 Year of productioa(tbelast two figuresof theyear) @ Month of production (to be indicatedalphabeticaIlywith Januuy corresponding A) to 0 Dateof producdon(01 3 1) -
r
Do-9910 15
JwW99
MODELNo.
GWWr952OOX
PAGZ
11113
6-3. Dampproof package In other to avoid the absorption of humidir)i h tnnspo~ and storage. the devices are packed in ahxninum sleeve.
Label
6-El.Strage conditions Temperature : 5 to 30C
Humidity : less than 6O%RH
6-3-2.Treatment after opening (1) Please make a soldering within 2 days ah opening under following condition; Tempezmre : 5 co 30C Humidity : less than 6O%RH (2) In case the devices are not used for a long he after opening .the storage in dry box is recommendable. Or it is better to repackhe deviceswith a desicative the sealer put themin the some by and storage conditionsas7-3-1. Then they shouldk ?sed within 2 days. (3) Please makea solderingafier a following h&king treatmeat unused if term shouldbe over the conditions of (2) Reconunenclable conditions:
0 in taping
Temprature:6O"C 65"C,Time:36to AShours to Q in individual (on PWl3 or metallic tray) Tempmture: 100C,Time:2 to 3 houn
GM5%-i95200A
1
1203
7. Soldering 7-IRedow
SOldeIiq (1) It is not rc=ornmended to exceed the soidering temperarum and time ~IOWU below. Caused by subsnare bend or the other mechanical stress &.ng reflow soldering may happen gold wire disconnection etc. Therefore please check and study your solder reflow machine's best condition. (2) Reflow soldering temperamre prome to be done under the following condition. to be done under the following condition.
MAX 250
Time (s)
Recommendable Thermal Model (4) Rccommcndable Metal Mask pattern for sLxen print Recommend O.tmm to 03mm thickness metal mask for screenprint. Caused by solder reflow condition, solder paste, substrate and the other martial etc., my change solderbility. Please check and study actual solderbihry before usage. Center of the product
Recommended solder pattern 7-2.Manual soldering (1) It ia recommended to keep the soldering iron temperature at 295x (soldering iron power ccnsumption 2Ow> and not to solder more than once or for over 3 seconds. (2) When using a soldering iron, care must be taken not to damage the package. (Pay attention not to allow any under stress or heat on package.) 7-3. Dip soldering method To be done under the following condition. Re-heat temp. : 80 to 120 "c time : 30 to 120 seconds Soldering temp. : Max. 260% time : within 5 seconds
8. Precautions for use 8-1. Precautions matters for designing circuit (l)This product is not designed as electromagnetic and ionized-particle diari~n resistant UThis LED device applies blue LED & Borescent mattrial to emit white &ht. Therefore, dependhrg on the vatue of operationcurrent, tone of the color maychannp slightly. Please check the tone underactualusage condition in advance. 8-2. Cleaning method (1) Solventcleaning is up Recommend conditions: 0 Solventtemperature not morethan45 "c. @ Immersion to 3 &mites. (2) UltrasoniccIeaning The affect on the devicefrom ultrasonicbath,uIbasonic output, duration,boardsizeanddevicemountingmethod. Test the cleaning methodunderactualconditions cheek abnotmahties and for beforeaotualuse. (3) SoIVenb Useonly the folIowing typesof solvent. water, alcoho1, chIorofluorocabon-based solventwhenc!eaning necessary. is Recommend conditions: RT. 40KHz, 3OW/l, 3 to 5 minutes 9. Environrnenr 9-I. Ozonosphere destructivechemicals. (I) The devicedoesn't containfollowing substance. (2) The devicedoesn't havea productionLine whose process requires foIlowing substance. Restricted part: CFCa,haIones,CCI~,TtichIoroethane.(MethychIorofotm) 9-Z. Bm& non-burning materials The devicedoesn't containbromicnon-burning materisIs(PBBOs,PBBs)

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